Download Intex Stock ROM For All Models
Here we have managed to provide Intex stock ROM for all models. By downloading and flashing this stock ROM on your device, you will be able to recover warranty, and the ability to get future stock updates.
Download Intex Stock ROM For All Models:
| Intex Model Number | Download Link | Stock ROM Country | Android Version |
| Intex Aqua 3.2 | Download | All | Android 2.3.6 |
| Intex Aqua 3G Mini | Download | All | Android 4.4.2 |
| Intex Aqua 3G | Download | All | Android 4.4.2 |
| Intex Aqua 3G Star | Download | All | Android 4.4.2 |
| Intex Aqua 3G Plus | Download | All | Android 4.4.2 |
| Intex Aqua 4 | Download | All | Android 2.3.5 |
| Intex Aqua 3X | Download | All | Android 4.4.2 |
| Intex Aqua 4X | Download | All | Android 4.2.2 |
| Intex Aqua 4.5E | Download | All | Android 4.4.2 |
| Intex Aqua 5.0 | Download | All | Android 4.4.2 |
| Intex Aqua 5 | Download | All | Android 4.0 |
| Intex Aqua A1 | Download | All | Android 4.4.2 |
| Intex Aqua 5X | Download | All | Android 4.4.2 |
| Intex Aqua Amaze | Download | All | Android 4.4.2 |
| Intex Aqua Active | Download | All | Android 2.3 |
| Intex Aqua Curve | Download | All | Android 4.2 |
| Intex Aqua Amoled | Download | All | Android 4.4.2 |
| Intex Aqua Desire | Download | All | Android 4.4.2 |
| Intex Aqua Curve Mini | Download | All | Android 4.4 |
| Intex Aqua Flash | Download | All | Android 4.0 |
| Intex Aqua Eco | Download | All | Android 4.2.2 |
| Intex Aqua Glow | Download | All | Android 2.3.6 |
| Intex Aqua Glory | Download | All | Android 2.3.6 |
| Intex Aqua HD 5.0 | Download | All | Android 4.4.2 |
| Intex Aqua HD | Download | All | Android 4.2 |
| Intex Aqua i3 | Download | All | Android 4.2.2 |
| Intex Aqua i2 | Download | All | Android 4.2 |
| Intex Aqua i4 Plus | Download | All | Android 4.4.2 |
| Intex Aqua i4 | Download | All | Android 4.4 |
| Intex Aqua i5 HD | Download | All | Android 4.2 |
| Intex Aqua i5 | Download | All | Android 4.4.2 |
| Intex Aqua i6 | Download | All | Android4.2 |
| Intex Aqua i5 Mini | Download | All | Android 4.2.2 |
| Intex Aqua i14 | Download | All | Android4.4.2 |
| Intex Aqua i7 | Download | All | Android 4.2 |
| Intex Aqua Kat | Download | All | Android 4.4.2 |
| Intex Aqua i15 | Download | All | Android 4.2 |
| Intex Aqua Marvel Plus | Download | All | Android 2.3 |
| Intex Aqua Marvel | Download | All | Android2.3 |
| Intex Aqua N4 | Download | All | Android 4.2.2 |
| Intex Aqua N2 | Download | All | Android 4.2 |
| Intex Aqua N8 | Download | All | Android 4.2 |
| Intex Aqua N7 | Download | All | Android 4.2.2 |
| Intex Aqua N15 | Download | All | Android4.4.2 |
| Intex Aqua N11 | Download | All | Android 4.4.2 |
| Intex Aqua Octa | Download | All | Android 4.2 |
| Intex Aqua N17 | Download | All | Android 4.2.2 |
| Intex Aqua P3 | Download | All | Android 4.4.2 |
| Intex Aqua P2 | Download | All | Android 4.4.2 |
| Intex Aqua Power HD | Download | All | Android 4.4.2 |
| Intex Aqua Power | Download | All | Android 4.4.2 |
| Intex Aqua Q3 | Download | All | Android 4.4.2 |
| Intex Aqua Q1 | Download | All | Android 4.4.2 |
| Intex Aqua R2 | Download | All | Android 4.4.2 |
| Intex Aqua Qwerty | Download | All | Android 4.2 |
| Intex Aqua S | Download | All | Android 2.3.6 |
| Intex Aqua R3 | Download | All | Android 4.4.2 |
| Intex Aqua Speed | Download | All | Android 4.4.2 |
| Intex Aqua Slice | Download | All | Android 4.4.2 |
| Intex Aqua Star 2 | Download | All | Android 4.4.2 |
| Intex Aqua Star | Download | All | Android 2.3 |
| Intex Aqua Star HD | Download | All | Android 4.4.2 |
| Intex Aqua Star 5.0 | Download | All | Android 4.4.2 |
| Intex Aqua Star L | Download | All | Android 5.0 |
| Intex Aqua Star Power | Download | All | Android 4.4.2 |
| Intex Aqua Style Mini | Download | All | Android 4.4.2 |
| Intex Aqua Style | Download | All | Android 4.0 |
| Intex Aqua Style 4.0 | Download | All | Android 4.4.2 |
| Intex Aqua Style Pro | Download | All | Android 4.4.2 |
| Intex Aqua Style X | Download | All | Android 4.4.2 |
| Intex Aqua Style VX | Download | All | Android 4.4.2 |
| Intex Aqua Swadesh | Download | All | Android 2.3 |
| Intex Aqua Superb | Download | All | Android 4.1 |
| Intex Aqua T2 | Download | All | Android 4.4.2 |
| Intex Aqua SX | Download | All | Android 2.3.6 |
| Intex Aqua T4 | Download | All | Android 4.4.2 |
| Intex Aqua T3 | Download | All | Android 4.4.2 |
| Intex Aqua Trendy | Download | All | Android 2.3.6 |
| Intex Aqua T5 | Download | All | Android 4.4.2 |
| Intex Aqua V Plus | Download | All | Android 4.4.2 |
| Intex Aqua V 3G | Download | All | Android 4.4.2 |
| Intex Aqua V4 | Download | All | Android 4.4.2 |
| Intex Aqua V2 | Download | All | Android 4.4.2 |
| Intex Aqua Wonder Quadcore | Download | All | Android 4.1 |
| Intex Aqua Wonder | Download | All | Android 4.1 |
| Intex Aqua X15 | Download | All | Android 4.4.2 |
| Intex Aqua X | Download | All | Android 4.4.2 |
| Intex Aqua Y2 | Download | All | Android 4.2 |
| Intex Aqua Xtreme | Download | All | Android 4.4.2 |
| Intex Aqua Y2 Remote | Download | All | Android 4.4.2 |
| Intex Aqua Y2 Pro | Download | All | Android 4.4.2 |
| Intex Cloud G | Download | All | Not Available |
| Intex Aqua Y3 | Download | All | Android 4.4.2 |
| Intex Cloud X Plus | Download | All | Android 2.3 |
| Intex Cloud FX | Download | All | Firefox OS |
| Intex Cloud X1 Plus | Download | All | Android 2.3 |
| Intex Cloud X1 | Download | All | Android 2.3 |
| Intex Cloud X3 | Download | All | Android 4.2 |
| Intex Cloud X2 | Download | All | Android 2.3.5 |
| Intex Cloud X4 | Download | All | Android 4.2 |
| Intex Cloud X3 Plus | Download | All | Android 4.2 |
| Intex Cloud X11 | Download | All | Android 4.2 |
| Intex Cloud X5 | Download | All | Android 4.2.2 |
| Intex Cloud Y1 | Download | All | Android 4.4.2 |
| Intex Cloud X12 | Download | All | Android 4.2 |
| Intex Cloud Y3 | Download | All | Android 4.2.2 |
| Intex Cloud Y2 | Download | All | Android4.2 |
| Intex Cloud Y4 Plus | Download | All | Android 4.2.2 |
| Intex Cloud Y4 | Download | All | Android 4.2.2 |
| Intex Cloud Y7 | Download | All | Android 4.2.2 |
| Intex Cloud Y5 | Download | All | Android 4.0 |
| Intex Cloud Y11 | Download | All | Android 4.2 |
| Intex Cloud Y10 | Download | All | Android 4.2.2 |
| Intex Cloud Y13 | Download | All | Android 4.2.2 |
| Intex Cloud Y12 | Download | All | Android 4.2 |
| Intex Cloud Y17 | Download | All | Android 4.2.2 |
| Intex Cloud Y13 Plus | Download | All | Android 4.2.2 |
| Intex Cloud Z5 | Download | All | Android 4.0 |
| Intex Cloud Y17 Plus | Download | All | Android 4.2.2 |
| Intex I-Buddy | Download | All | Android 4.0.4 |
| Intex Cloud Z6 | Download | All | Android 4.2 |
| Intex I-Buddy 7 | Download | All | Android 4.0.4 |
| Intex I-Buddy 3 | Download | All | Android 4.0.4 |
| Intex I-Buddy Connect 3G | Download | All | Android 4.0.4 |
| Intex I-Buddy 7-2 | Download | All | Android 4.0.4 |
| Intex I-Tab 5T | Download | All | Android 2.3 |
| Intex I-Buddy Connect II 3G | Download | All | Android 4.0.4
|
Note:
1) All the stock ROMs which we have given above are provided officially by Mobiles. If you encounter any issues with these stock ROMs while trying to flash them, contact Mobile support.
2) If you would want to connect your Spice android devices to the computer, download Spice USB drivers and install it in your computer.
#Do it on your Risk
@Asia Telecom
What is PCB ?
A PCB (printed circuit board) or PC board is a piece of phenolic or glass-epoxy board with copper clad on one or both sides. The portions of copper that aren't needed are etched off, leaving "printed" circuits which connect the components.
PCB is used to mechanically support and electrically connect electronic components using conductive pathways, or traces, etched from copper sheets laminated onto a non-conductive substrate.
It is also sometimes referred to as printed wiring board (PWB) or etched wiring board. A PCB assembled with electronic components is called printed circuit assembly (PCA), OR printed circuit board assembly (PCBA).
PCBs are rugged, inexpensive and highly reliable.
The electronics industry's PCB design, assembly, and quality control needs are set by standards that are published by the IPC organization.
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Printed Circuit Board (PCB) Manufacturing Process:
The printed circuit board manufacturing process is a very difficult and complex process.
Patterning | Etching : Majority of printed circuit boards are manufactured by applying a layer of copper over the entire surface of the PCB substrate either on one side or both sides. This creates a blank printed circuit board, with the copper everywhere on the surface. From here the unwanted copper is removed by subtractive methods.
Photoengraving : The photoengraving process uses a mask or photomask combined with chemical etching to subtract the copper areas from the circuit board substrate.
The photomask is created with a photoplotter which takes the design from a CAD PCB software program. Lower resolution photomasks are sometimes created with the use of a laser printer using a transparency.
Lamination: Many printed circuit boards are made up of multiple layers; these are referred to as multi-layer printed circuit boards. They consist of several thin etched boards or trace layers and are bonded together through the process of lamination.
Drilling : Each layer of the printed circuit board requires the ability of one layer to connect to another, this is achieved through drilling small holes called "VIAS". These drilled holes require precision placement and are most commonly done with the use of an automated drilling machine. These machines are driven by computer programs and files called numerically controlled drill or (NCD) files also referred to as excellon files. These files determine the position and size of each file in the design
Controlled depth drilling can be used to drill just one layer of the circuit board rather than drilling through all the layers. This can be accomplished by drilling the individual sheets or layers of the PCB prior to lamination.
The walls of each hole (for multi-layer boards) are copper plated to form plated-through holes that connect the conductive layers of the printed circuit board.
Solder Plating | Solder Resist: Pads and lands which will require components to be mounted on are plated to allow solderability of the components. Bare copper is not readily solderable and requires the surface to be plated with a material that facilitates soldering. In the past a lead based tin was used to plate the surfaces, but with RoHS(Restriction of Hazardous Substances) compliance enacted newer materials are being used such as nickel and gold to both offer solderability and comply with RoHS standards.
Areas that should not be solderable are covered with a material to resist soldering. Solder resist refers the a polymer coating that acts as a mask and prevents solder from bridging traces and possibly creating short circuits to nearby component leads.
Silk Screen: When visible information needs to be applied to the board such as company logos, part numbers or instructions, silk screening is used to apply the text to the outer surface of the circuit board. Where spacing allows, screened text can indicate component designators, switch setting requirements and additional features to assist in the assembly process.
Testing: Unassembled circuit boards are subjected to a bare board test where each circuit connection is verified as correct on the finished circuit board. In high volume circuit board production, a bed of nails tester or fixture is used to make contact with the copper lands or holes on one or both sides of the board to facilitate testing. Computers are used to control the electrical testing unit to send a small current through each contact point on the bed of nails and verify that such current can be detected on the appropriate contact points.
For small to medium volume production runs, a flying probe tester is used to check electrical contacts. These flying probes employ moving heads to make contact with the copper lands and holes to validate the electrical connectivity of the board being tested.
Mobile Hardware Sections
- Keyboard or Keypad Section: The keyboard section of any mobile cell phone is directly connected with the CPU. This means that rows and columns of keys are directly connected with the CPU. Protector IC or Interface IC or Verector diode is connected in the row or column line for the protection of key section. In modern mobile cell phones which have qwerty keys, a separate control IC is connected with the CPU for extra protection to the keys.
- Display Section: The display section is directly connected with the CPU to receive following signals – LCD Data Signal, LCD Reset Signal, LCD WR Signal, LCD RD Signal, LCD FLM Signal, LCD HSYN Signal etc. These signals are given to the LCD Module through the CPU. 2.8V power supply or 1.8V power supply is given to the LCD for functioning. LCD signal interface filter are connected in many mobile cell phones for interfacing these signals of LCD Module.
- SIM Card Section: The SIM Card Interface section is directly connected with the CPU in most mobile cell phones. If there is no power supply in a mobile phone then the SIM section is connected with the CPU through the Power IC. Mainly V-SIM (3.0V), SIM-RST (2.85V), SIM CLK, SIM-Data (2.5V), and SIM GND are made in the SIM Section. These four pins (Beside (SIM GND) are directly connected with the SIM interface / control section and V-SIM volt are given to the SIM data pin from V-SIM pin through the 10-18 Kilo Ohms Resistance.
- Memory Card Section: Now mostly Micro SC Card is connected in most mobile cell phones which is connected with micro card section through a 8 pin socket. Memory card section is made inside the CPU. Description of these 8 pins are as follows:
- MMC-Data-2
- MMC Data
- MMC CMD (Command)
- VMMC / VSD (Positive Supply Pin)
- MMC-CLK
- GND
- MMC-Dta0
- MMC Data-1
2.8 Volt Power is supplied to Pin Number 4 from Power Supply for functioning of the MMC Card and connection the 50 tp 100 Kilo Ohms resistance in this power supply. This power supply is given to Pin Numbers – 1,2,3,7,8 of MMC Socket. One MMC detector switch or pin is made in MMC socket at which, if there is no MMC Card then 1.8 V power is continuously received and after the MMC is connected, it becomes zero.
- MIC Interface Section: MIC interface section is directly connected with the CPU inmost mobile phones. Working voltage (MIC Bios) (1.8 to 2.8 V) is supplied from the CPU or the Power Supply Section for functioning of the MIC and MIC Positive and Negative Volt are input through two capacitors.
- Ear Speaker Section: In most modern mobile cell phones, in which there is a separate ear speaker, it is directly to the CPU. It receives sound via signals directly from the CPU of from the audio section inbuilt within the CPU. In some mobile phones, these sound signals are received via coil / resistance. Some mobile phones have audio IC in the audio section. Some mobile phones have audio amplifier.
- Speaker / Ringer Section: Ringer, Buzzer or Speaker in most mobile phones are connected with the audio amplifier IC to obtain loud sound. The amplifier IC amplifies the sound or audio signal received from the CPU of the audio section.
- Key Backlight Section: LED Lights are connected according to the parallel circuit in the key backlight section. Anode ends of all the LEDS are connected to each other and all the cathode ends are to each other. 3 to 3.3 V is supplied for the functioning of these Key LED Lights. This power supply is given to the cathode ends of LEDs from the ground ends. Power supply to the anode ends of LED Lights is controlled bu using LED-Driver or PNR IC.
- LCD Backlight Section: LCD Backlight in mobile cell phones is made according to the series circuit. A Boost Voltage Generator Section is built for the supply of high voltage (10 to 18V) for the functioning of the LCD LED. Boost coil, Boost Volt Driver IC, Rectifier Diode etc are present in this section.
- Vibrator Motor Section: Positive power supply is given to this section directly from the positive end of the battery. Negative power supply is given through a NPN transistor or from the ground of any circuit.
- Network Section: Antenna, External Antenna Socket, RX-Band Pass Filter, RF Crystal, FEM, PFO, TX-Band Pass Filter, RF IC, CPU are connected in the Network Section. Signal received at the antenna during the RX is given to the antenna switch or FEM through the antenna socket where the next processing is completed by selecting a frequency of proper band and is passed on to the RF IC through RX-Band Pass Filter. RF Signal out from the RF IC during TX is given to the FEM or PFO to amplify the signal. After the Band Selection Process the signal is passed through the antenna.
- Battery Charging Section: Charger and system interface connector is made together in most modern mobile cell phones. Regulator section is made separately for the battery charging section. In some mobile phones, the battery charging section is made inside the Power IC.
- FM Radio Section: FM Radio Driver IC, FM Antenna, Signal and Supply Components are made in the FM Radio Section.
- Bluetooth Section: Bluetooth Antenna, Bluetooth RF Signal Filter, Bluetooth Driver IC, Supply and Signal Components are made in this section. The Bluetooth sections functions like the Network Section. RF-CLK signal is given to the Bluetooth driver IC during signal processing.
- Set Power ON: Power IC, CPU (UCP), Flash IC, RF-CLK, Crystal, RF-IF, PWR Ket etc components are present this section. Battery positive supply is given to the power IC and connecting the battery (3.7V) from 2.87 to 3.0 Power ON Volts are received at one tip of the Power Key. Supply is given to the CPU, Flash IC, RF-CLK, Generator Section (RF Crystal, RF IC) by which the mobile phone gets switched ON.
- Handsfree (Earphone Section): Mainly hands free jack, hands free MIC, speaker signal component and hands free audio amplifier are present in this section. Hands free symbol is displayed after connection the Handsfree jack.
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